Aluminum Foil Bag for Electronics Chips Packing

Model NO.: SZ-MB002
Bag Variety: Open Top, Ziplock, Three Dimensional, Gusset
Function: Anti Static, Moisture Barrier, Light Isolation
Industrial Use: Electronic Components, Semiconductive Industry
Color: Silver
Surface Handling: Gravure Printing
Bag Type: Open Top, Zip Lock, Three Dimensional, Gusset
Trademark: DIASAP
Transport Package: 50 - 100PCS Per Bag, 5 - 50 Bags / Carton
Specification: SGS ROHS report
Origin: Suzhou, China
HS Code: 3923210000
 Aluminum Foil Bag for Electronics Chips Packing
 
This aluminum foil bag is usually composed of four layers, and can protect inside products from static, electromagnetic interference, and moisture.

This aluminum foil moisture proof bags are mainly applied to pack electronic components

(PCB, IC, HD driver)precise equipment and chemical raw material etc.

This customized plastic bag is featured by moisture barrier, anti-tearing, light isolation, and vacuum, esp. in long-distance sea shipment.

This laminated bag can print all symbols and can be customized according to customers' request.


This third party reports can be offered, such as ROHS, Halogen testing report. This material meets the environment requirement of EU and North America in package.
 
 
Product Description
Product Name  Aluminum Foil Bag for Electronics Chips Packing
 
Material Structure
Layers Laminated Material:
 
PET/AL/NY/PE  BOPP/AL/PE
Feature Anti-static, moisture barrier,light isolation
Printing Customized
Surface Resistance 10^6~10^11 Ohm
Thickness Customized(0.06--0.2mm available)
Bag Style Open top/ zip lock/ envelope/ gusset/ three dimensional
Package 50~100pcs per bag and then in cartons or as per customer's request
 
Usage
Electronic components (PCB, IC, HD driver),precise equipment and chemical raw material etc.
 

Technical Parameters:
NO. Item Standard Result
1 Puncture Strength MIL-STD-3010B ≥24LBF
2 Surface resistivity ASTM D-257 10^6-10^11ohm
3 Decay time  IEC61340-5-1 <0.3s
4 WVTR ASTM F1249 ≤0.0006g/100in²/24hs
5 OTR ASTM D3985 ≤0.01cc/100in²/24hs
6 Heat-Seal Temperature   160%±10%
7 Heat-Seal Pressure   70Pa
8 Heat-Seal Time   ≤1.5S
 
Product Pictures: 

Aluminum Foil Bag for Electronics Chips Packing


Factory show:
Aluminum Foil Bag for Electronics Chips Packing
 
 
Other related products:
1.     Moisture barrier Bags/Aluminum Foil Bag
2.     ESD Bubble Cushioned Bag
3.     Nylon Bag/Vacuum Bag
4.     Air Bubble Bag/making machine
5.    Industrial Cotton Swab Series 
6.    Humidity Indicator Card
7.    Cleanroom  Consumable Series
 
 

Contact us:
Abby 
Suzhou SKY Industrial Co., Ltd.
Add.: 36# Zhong'An Road, Puzhuang, Suzhou, Jiangsu, China
Zip code: 215105
 
 


Free samples will be sent for your evaluation!   

 

Auto Car Mugs

Auto Car Mug,Travel Mug,Travel Bottle

Coffee Pot,Bottle Co., Ltd. , http://www.cnthermos.com

Posted on