Researchers at the Food Technology Center of Gueph University in Ontario, Canada recently developed a new type of PEN polyethylene tea-phenolic resin that is resistant to high-heat food packaging materials.
According to the researchers from the center, the PEN/PET new material has been formed after the use of this PEN polyethylene tea phenol resin material and the current traditional food packaging material PET polyethylene terephthalate mixture, which is resistant to high heat and brittleness. Cracking, fear of moisture, oxidation resistance and UV radiation resistance. Because the new food packaging material has the characteristics of high heat resistance, the food packaging can be completed in the high temperature treatment, so the food life can be effectively extended.
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