High-temperature curing metal-plastic bonding adhesive formula

Epoxy adhesive formulation component dosage/g
H-71 epoxy resin 170
647 # anhydride 116 ~ 130
Glycerine 6.2

Preparation and curing
Weigh in order and mix evenly. The bonding pressure is 0.4 MPa. The curing conditions were 120°C for 1 h, 160°C for 1 h, cooling to 60°C, curing at 160°C for 3 h, curing at 200°C for 4 h, and curing at 250°C for 3 h.
use
The glue is used for bonding between metal and plastic at high temperature.

Source: 21st Century Fine Chemicals Network