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In August 2015, the US federal government invested $75 million through the National Manufacturing Innovation Network to establish the Flexible Hybrid Electronics Manufacturing Innovation Institute (FHE-MII) to address the challenges of electronic product change.
Mixed Institute for Flexible Electronics Manufacturing Innovation (Flexible Hybrid Electronics Manufacturing Innovation Institute ( FHE-MII) and additive manufacturing Research Institute (America makes) belong to the National Manufacturing Innovation Network (NNMI). The National Manufacturing Innovation Network (NNMI) Designed to create a competitive, effective and sustainable research-to-manufacturing research-to-manufacturing system. The US federal government's goal is to establish 45 such institutions to enable the US industry and academia to work together to address related industries. The challenges that are increasingly emerging.
The United States is particularly strong in print research on structural functional electronics. Typical companies include Voxel8 from Harvard, MultiFab from MIT, and Optomec, which has just acquired GE and Autodesk investments. The establishment of FHE-MII will form a strong response to America makes, we can foresee the 3D printing technology of functional electronics, and the United States is leading the rise.
The unparalleled advantage of 3D printing is the production of complex products, including fixtures, aircraft components and dental medicine applications. As these applications become more popular, another application: printing on electronic features has surfaced, and integrated electronic structures, including sensors (strain gauges, temperature sensors or deformation sensors), are enhancing 3D printing. The importance of it.
Integration is a constant exploration effort. Initially, the development experts only integrated the sensors into the electronics, while the sensors and electronics were manufactured in separate processes, whether on ceramic or flexible substrates.
However, as materials and processes mature, 3D printing technology is becoming more integrated. While one-step completion does not seem to be a glimpse at the moment, electronic 3D printing of integrated functional structures is becoming a trend after careful evaluation of materials, design and development features, and deployment of manufacturing and testing processes.
In the past year, we have seen a 3D printed phone cover with a test platform that integrates 3D printed antennas, through detailed and systematic development solutions. It is now easy to benchmark integrated antennas, either molded interconnect processes or etched ram antennas.
Benchmarks for 3D printed cell phone covers and antennas were created by creating a 3D printed RF test fixture for testing in commercial and existing coverage and in an appropriate RF environment. The CAD file and file format are processed by using the numerical values ​​of the electromagnetic field numerical simulation as a reference. Then measure the untouchable 3D printed phone cover material, and confirm the most suitable modeling method and the most suitable printing method based on experience and data.
The significance of integrated technology also includes the integration of conventional polyester products with printed or printed polyester on a hard or flexible circuit board. Such technology can help customers enhance specific product values, including quality, cost, availability and reliability.
In the future, can you print out a smartphone at a time? Maybe not impossible...
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